Webinars and workshops
ZeroAMP Final Workshop – Logic,Memory, Sensors and More for Harsh Environments
- 29 October 2023
- IEEE Sensors 2023, Vienna, Austria
Workshop "Electronics for extreme environments"
- 30 June 2022
- Clifton Hill House, Bristol, UK
ZeroAMP Project – NEMS Switch Devices and Packaging for Harsh Environments by Piers Tremlett, Microchip Technology Inc
- 12 January 2022
- IMAPS-UK webinar
Scientific publications
Participation at scientific events
Final ZeroAMP conference
IEEE Sensors 2023 Conference 29 October - 1 November 2023, Vienna, Austria - exhibition with a booth by Jens Bolten (AMO)
MNE 2023
Micro and Nano Engineering MNE 2023 conference 25-28 September 2023, Berlin, Germany - exhibition with a booth by Jens Bolten (AMO)
Invited talk at Transducers 2023
IEEE Transducers 2023 on Solid-State Sensors, Actuators and Microsystems, 25-29 June 2023, Kyoto, Japan - invited talk by Dinesh Pamunuwa (UNIVBRIS) on the nanomechanical technology for electronics developed in the ZeroAMP and i-EDGE projects.
IEEE Transducers 2023
IEEE Transducers 2023 on Solid-State Sensors, Actuators and Microsystems, 25-29 June 2023, Kyoto, Japan - poster by Yingying Li (KTH) "Design and Fabrication of a 4-Terminal in-plane Nanoelectromechanical Relay"
Girl's Day 2023
Girl's Day 2023, 27 April 2023 - 11 high school girls hosted by AMO to introduce the career options in science, technology, engineering and mathematics (STEM)
IMAPS HiTEC, CICMT & Power Packaging 2023
IMAPS HiTEC, CICMT & Power Packaging 2023 Conference on high temperature electronics, 18-20 April 2023, Albuquerque, USA - presentation by Dinesh Pamunuwa (UNIVBRIS) "Edge Computing Platform based on Nanoelectromechanical Relays"
IEEE MEMS 2023
IEEE MEMS 2023 Conference on Micro Electro Mechanical Systems, 15-19 January 2023, Munich, Germany - poster by Elliott Worsey (UNIVBRIS) "FULLY MICROELECTROMECHANICAL NON-VOLATILE MEMORY CELL"
WaferBond '22
WaferBond '22, Conference on Wafer Bonding for Microsystems, 3D- and Wafer Level Integration, 04-06 October 2022, Schmalkalden, Germany - presentation by Gaehun Jo (KTH) "Wafer-level Hermetic Sealing of Silicon Photonic MEMS by Direct Metal-to-Metal Bonding"
MNE EUROSENSORS 2022
Micro and Nano Engineering MNE EUROSENSORS 2022 conference 19-23 September 2022, Leuven, Belgium - exhibition with a booth by Jens Bolten (AMO)
Industrial Award UNIVBRIS
Industrial Innovation Concept Award from MBDA, 17 June 2022 - Dinesh Pamunuwa, Mukesh Kulsreshath and Elliott Worsey (UNIVBRIS) received this award for a NVM prototype based on NEM relays developed in ZeroAMP
Girl's Day 2022, 28 April 2022 - 7 female high school students hosted by Jens Bolten (AMO) to introduce the broad field of nanotechnology
Girl's Day 2022, 28 April 2022 - 7 female high school students hosted by Jens Bolten (AMO) to introduce the broad field of nanotechnology
IMAPS-UK Online Conference “ZeroAMP – Ultra Low-Power Logic and Memory for Harsh Environments” 12 January 2022 - presentation by Piers Tremlett (MICROCHIP)
IMAPS-UK Online Conference “ZeroAMP – Ultra Low-Power Logic and Memory for Harsh Environments” 12 January 2022 - presentation by Piers Tremlett (MICROCHIP)
European Space Agency Online Workshop “Hybrid & Packaging Working Group Meeting # 51” 01 December 2021 - presentation by Piers Tremlett (MICROCHIP) "Microchip Packaging and Assembly , Caldicot, UK"
European Space Agency Online Workshop “Hybrid & Packaging Working Group Meeting # 51” 01 December 2021 - presentation by Piers Tremlett (MICROCHIP) "Microchip Packaging and Assembly , Caldicot, UK"
CW ITP Conference 27-28 October 2021, Nice, France - invited talk by Dinesh Pamunuwa (UNIVBRIS) on relay-based non-volatile memory
CW ITP Conference 27-28 October 2021, Nice, France - invited talk by Dinesh Pamunuwa (UNIVBRIS) on relay-based non-volatile memory
Graphene 2021 conference 26-29 October 2021, Grenoble, France - exhibition with a booth by Zhenxing Wang (AMO)
Graphene 2021 conference 26-29 October 2021, Grenoble, France - exhibition with a booth by Zhenxing Wang (AMO)
Micro and Nano Engineering MNE2021 conference 20-23 September 2021, Turin, Italy - exhibition with a booth by Jens Bolten (AMO)
Micro and Nano Engineering MNE2021 conference 20-23 September 2021, Turin, Italy - exhibition with a booth by Jens Bolten (AMO)
IMAPS Online Conference “Technology Crossover Extravaganza” 26-29 April 2021 - presentation by Piers Tremlett (MICROCHIP) "High Temperature Sensor Interface Circuitry and Control Systems: Components and PCB Assemblies"
IMAPS Online Conference “Technology Crossover Extravaganza” 26-29 April 2021 - presentation by Piers Tremlett (MICROCHIP) "High Temperature Sensor Interface Circuitry and Control Systems: Components and PCB Assemblies"
SPIE Photonic West 2021 6–11 March 2021 - presentation by Gaehun Jo (KTH) "Optical and Electrical Feedthroughs for Wafer-Level Vacuum Sealed Silicon Photonic MEMS Packages"
SPIE Photonic West 2021 6–11 March 2021 - presentation by Gaehun Jo (KTH) "Optical and Electrical Feedthroughs for Wafer-Level Vacuum Sealed Silicon Photonic MEMS Packages"
IEEE MEMS 2021 Online Conference 25-29 January 2021 - open poster and flash presentation by Dinesh Pamunuwa (UNIVBRIS) "Stiction-Based Non-Volatile Memory For Harsh Environments"
IEEE MEMS 2021 Online Conference 25-29 January 2021 - open poster and flash presentation by Dinesh Pamunuwa (UNIVBRIS) "Stiction-Based Non-Volatile Memory For Harsh Environments"
IEEE MEMS 2021 Online Conference 25-29 January 2021 - open poster and flash presentation by Dinesh Pamunuwa (UNIVBRIS) "Stiction-Based Non-Volatile Memory For Harsh Environments"
IEEE MEMS 2021 Online Conference 25-29 January 2021 - open poster and flash presentation by Dinesh Pamunuwa (UNIVBRIS) "Stiction-Based Non-Volatile Memory For Harsh Environments"
IMAPS-UK Online Conference “Making Sense of Sensors” 12 November 2020 - presentation by Piers Tremlett (MICROCHIP) "Making Sense of Interface Circuitry for High Temperature Sensors and Control Systems"
IMAPS-UK Online Conference “Making Sense of Sensors” 12 November 2020 - presentation by Piers Tremlett (MICROCHIP) "Making Sense of Interface Circuitry for High Temperature Sensors and Control Systems"
Publishable summary
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